I quite frankly doubt that intel is going to release another generation of CPU's for the 300 series LGA1151 socket, as we already have the 8 and 9 series "high end" Coffee Lake and Coffee Lake Refresh CPU's on that socket, and any higher TDP CPU than 35W is obviously going to have thermal throttling issues given the fan and heatsink size. Given the connectivity available from either the LGA1151 CPU or the H310 chipset that does suggest that the module "connector" is undoubtably PCI Express. I would love to be able to read the patent number on the motherboard and see if it matches the one way back in this thread, or if it's something different..