Welp, here goes...

[Mehridian Sanders]

So this trek begins...

 

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[Mehridian Sanders]

Something just occurred to me. If this is a STFM ... where's the video modulator in the back?
I think I'll have to look under the hood when I get home.

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[MasterMotorola]

Nice catch.  This computer was probably rebadged or re-cased.  What does the sticker on the underside say?

[ParanoidLittleMan]

Don't see RF output. But not some big waste. Should use RGB out for quality.

 

[Mehridian Sanders]

Don't see RF output. But not some big waste. Should use RGB out for quality.
 

I agree. I didn't have a chance last night to look. Will get those tonight.

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[Mehridian Sanders]

On 6/8/2020 at 5:09 PM, MasterMotorola said:

Nice catch.  This computer was probably rebadged or re-cased.  What does the sticker on the underside say?

Sticker on Underside says STF. I think I was bamboozled.I should have been tipped off on this. The Top and Bottom were different colors 

 Disk Drive : Sony MP-F11W-U0

[Mehridian Sanders]

Ewwwwwww

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[MasterMotorola]

That last picture was nasty but it should clean up okay with a scrub and vacuum.  I've seen much worse... grease, dust bunnies, hair, and dead insects on the insides.

 

So other than it not actually being an M model, the computer works as far as you know?  Looks like you have lots of neat upgrades for it.

[Mehridian Sanders]

Well got the Gotek drive I will have to configure. Pulled the floppy drive ... Looks nice actually ..
Have to get that aluminium shield off there though more in about an hour. I have breakouts for all the connections save the MIDI ports but those will probably be ordered on friday

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[Mehridian Sanders]

Here it is.. not STfm just STf.

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[Mehridian Sanders]

TOS under the Power Supply 6 TOS chips

 

This just makes me want to find a way to put a 512k SPI chip in its place. 

 

On a side note ... this looks intruiging.

 

Winbond

HyperRAM^TM devices with Wafer Level Chip Scale Package (WLCSP) help make form factor smaller and simpler

In terms of memory density, Winbond provides four product lines of 32Mb, 64Mb, 128Mb, and 256Mb for different customer applications.
In terms of package type, Winbond also provides a variety of options, including:
24-ball, 8mm x 6mm TFBGA for automotive and industrial applications
49-ball, 4mm x 4mm WFBGA for consumer applications
15-ball, 1.48mm x 2mm Wafer Level Chip Scale Package (WLCSP)
Known Good Die (KGD)